Runyu Ding
Ph.D. student
Department of Electrical and Electronic Engineering
The University of Hong Kong
Email: dingry977 [at] gmail [dot] com
[Google Scholar]
[GitHub]
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Biography
I am currently a Ph.D. student (2020-) at EEE, The University of Hong Kong, advised by Dr. Xiaojuan Qi. Before that
I obtained my B.Eng. degree in the School of Software Engineering at Tsinghua University in 2020.
My research interests focus on 3D vision and embodied AI.
Publications
*: Equal Contribution
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RegionPLC: Regional Point-Language Contrastive Learning for Open-World 3D Scene Understanding
Jihan Yang*, Runyu Ding*, Zhe Wang, Xiaojuan Qi
arXiv preprint, 2023
[Project Page]
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PLA: Language-Driven Open-Vocabulary 3D Scene Understanding
Runyu Ding*, Jihan Yang*, Chuhui Xue, Wenqing Zhang, Song Bai, Xiaojuan Qi
Computer Vision and Pattern Recognition Conference (CVPR), 2023
[Project Page] [Code]
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Towards Efficient 3D Object Detection with Knowledge Distillation
Jihan Yang, Shaoshuai Shi, Runyu Ding, Zhe Wang, Xiaojuan Qi
Advances in Neural Information Processing Systems (NeurIPS) 2022.
[Code]
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DODA: Data-oriented Sim-to-Real Domain Adaptation for 3D Semantic Segmentation
Runyu Ding*, Jihan Yang*, Xiaojuan Qi
European Conference on Computer Vision (ECCV), 2022.
[Code]
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PAConv: Position Adaptive Convolution with Dynamic Kernel Assembling on Point Clouds
Mutian Xu*, Runyu Ding*, Hengshuang Zhao, Xiaojuan Qi
Computer Vision and Pattern Recognition Conference (CVPR), 2021.
[Code]
Experiences
Research Intern, STCA Microsoft.
July 2019 - Aug. 2019
Activities
Conference Reviewer: CVPR, ICCV, ECCV
Journal Reviewer: IJCV, PR
Talk:
Language-Driven Open-Vocabulary 3D Scene Understanding. C3DV Workshop in CVPR 2023.
Language-Driven Open-Vocabulary 3D Scene Understanding. VALSE 2023.
DODA: Data-Oriented Sim-to-Real Domain Adaptation for 3D Semantic Segmentation. Zhidongxi.
PAConv: Position Adaptive Convolution with Dynamic Kernel Assembling on Point Clouds. Jiangmen.
Education
Tsinghua University
Sept. 2015 - June 2020
Bachelor Degree in Software Engineering
GPA 3.91/4.0. Ranking 3/84.
Honors & Awards
Hong Kong PhD Fellowship Award (HKPFS) |
2020 |
Good Graduate of Tsinghua University |
2020 |
Outstanding Graduate of School of Software, Tsinghua University |
2020 |